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[招聘] 深圳猎头急招以下职位(工作地 深圳)

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发表于 2007-10-15 15:01 | 只看该作者 回帖奖励 |倒序浏览 |阅读模式
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Asset Management Leader
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/ j5 P# q' L4 M) oJob Responsibilities
( M) w$ h7 c" {) e& H8 h+ o•Take Leadership to drive whole ISSC HW and SW Management., |* n! M1 J' ?: ^9 u( A# Y0 F
•Be familiar with IBM practice and stick to IBM rules./ e$ U2 Y  M' G& [. E
•Take initiatives to improve current Asset management process regularly or when needed.
; `0 B4 C  H. T! }- S•Strong in implementation of process in ISSC all sites and escalate any noncompliance.- [! i9 V* I; z0 x2 k
•Reminder, trigger, and check all sites regular physical check.. T3 G8 H4 |- N
•Maintain the Asset management tracking DB to ensure all required evidence is kept properly.
0 w0 Y: U/ o) v) s  `6 \•Follow up whole process for all Asset related incident.' v+ V7 c3 a7 a4 v0 M( @. W
•Interlock with BC closely.7 }5 h) [3 ?7 g$ }
•Regular update to management team and follow up for any action required.
, x; a* W- L% A1 T: Q2 [Job Requirements (skills/experiences) : u: p* G: W( ^7 K% J& t: G
1.At least Bachelor, with more than 3 years working experience in internal company.& C+ }( F; {, }+ t! R
2.Any work experience of Asset management/operation/Administration/Business control is advantage
, r- ]% S0 i* S: K0 G2 o3.CET 6, Could communicate by oral or written English very well.1 e' P9 ~6 a6 `- I0 T' o( S8 o
4.Strong in Leadership and execution.
8 v8 m0 J( Y! [+ X, q5.Good communication skill, can coordinate with multiple sites and departments.6.   
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# Y" [* c* q7 G9 F* ^$ B9 r$ f0 yHR Supervisor/ F6 U, f+ r7 h+ N8 I
性别:不限, 年龄:26岁以上, 学历:大专或以上学历' X" ^  x: A' [$ u! N
5 l/ Y0 q  v- B+ c' ?9 b$ y+ E; S
Job description:
& y. o  P* I8 W# s工作描述:
& J" ~5 n# F% q( BFollow up orientation program! z5 |+ l3 j) \( Z+ M! E: A
Follow up annual training plan
% ^' T* g. j; c$ ?  }# WOrganize training activities in accordance with training process and policy' Q4 N* K7 R9 S6 P
Improve communication within company. Deal with employee complains, conflicts and bridge communication between employees and management Present corporate culture and code of conduct% l9 a/ L% D; b4 m  ~& a3 y# H" l  o
Introduce HR program5 Z5 {, @( C: t3 z
Establish HR relative intelligence (e.g. training trends)
: }% ]/ H8 R2 z7 g7 G. RPlan and organize employee events (e.g. birthday party; marriage celebration)* a  r1 K. m! S

7 X7 U7 V5 l* @: R) k3 e8 MRequirement:, j( ~, [3 ~. }  B2 L( I8 i
职位要求:7 h* D9 A* J$ z/ s# s4 P
•BA degree in HR management or related discipline8 n' ]2 E" j1 b1 n# g: V6 m
•Min. 5 Years related work experience) ~7 Z: w( Y: B! m1 w
•Good presentation skill
8 g/ @, h2 O" ?5 L•Excellent English & Chinese languages skill+ u3 n0 w  q- G# a: {5 M7 V

8 V# D/ |/ h$ A( e6 U" |1 b, {$ l" w
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Network Management Center Team leader4 `$ ?. P$ i( L8 Q; Q
9 Q8 B7 e& n, Z
Job Roles and Responsibilities
: {7 q. @+ ^: {[Documentation support (of NMC JP team in the GD site)]2 A9 P* S* C& e; i2 T& C1 |
Customers’ hearing (for PAW, SOW Information) ; R5 }$ I- p. [, h0 T& u- H" u
Prepare PAW, SOW draft- A+ E6 \  A' u- E6 C2 E
Prepare CTM, RiskReview draft- o& q  N9 X& @
[Management support (of NMC China team in the GD site)] ' t  r# Y& ^, n" y2 Y( b+ }
Work Schedule(WBS) Control of NMC Personnel in SZ5 D# Q5 w9 v' g  ]5 _. p
Work tracking of NMC Personnel in SZ
+ V  f% w8 K6 \5 D# uProgress tracking of NMC Personnel in SZ Problem Management
- V/ I+ C4 I$ P0 V0 h) v1 n  PWeekly meeting w/NMC JP team
9 A. C$ h0 ~+ j0 r4 YPrepare the weekly reports to NMC JP which includes following:8 U, z" s* V8 O% i8 C1 y
1. Program Accomplishments and Effort7 }7 i9 M- I( o) r5 X
2. Areas of concern (identifying risk items)
* ^9 v& @) K! R% k# K' t6 }3. Unresolved issues (impact on project)- y0 e, n& M3 Q) n# _
4. Action plan (suggestions to resolve issues of concern)+ G7 @+ g: W  f, U' _
5. Plan for the next period (indicating all dependent tasks)! y: H* X3 E9 h! n1 \' E# T2 b
6. Periodical Billing and Invoices for labor and other expenses; p# R  H6 z; q/ I
7. Improvement areas identified if any  
4 s" M$ a) W! S, |% TJob Requirements & Qualification (skills/experiences) . V& E3 Q) K/ r5 w4 Q+ D; L3 l
- Advanced TCP/IP skill, Cisco Devices' Management & Operation skills% b" z6 Y% n0 E+ }# w" t' J! m
- Good Lotus Notes skill      . h1 c. W# A' B0 u
- Good MS Office Skill      
* ~1 a6 U8 p) |2 V: g! k, z- Business Analysis & Process Improvemen ( A1 J0 Q9 [) c

% m- F0 X. k0 N1 iSpecial Requirement (Education/Major/Certificates)$ a  N, M. _2 C- J# c9 i
- Communication skills (fluent verbal and written English)+ C3 V: y2 U& \
- Good leadership skills ' G" b0 m1 S" }: H% P) ~, N8 _
- Japanese language skill – Level 1     3 Z# `5 z& \1 S' A/ {( e% f6 `
- Good interpersonal and Negotiation skills 9 @% _/ F. }8 ]: _6 ~
7 U, v) Q5 o% Y& @

! b* A2 j6 [5 B6 j7 p8 k/ y6 RLVDT design engineer1 S0 P0 [" K5 w  u

8 n; C' ^1 K4 v8 P! BRequirements:
; u1 n1 O1 |2 b, N  `6 h$ d+ X1.Electromagnetic Knowledge- Design the Transformer requires certain degree of understanding to Electromagnetic theory
0 l" J  a2 D8 [( O6 p9 F; t* A" Z2.Design tools used- Ansys or other equivalent software,
4 X* _* v6 Q: H$ c# k% y7 l! {3.Transformer related engineering Material understanding- including magnet wire, high permeability alloy, insulation material
, ^6 G; v' |& C$ t* p" e# b4.Basic knowledge of analog circuitry, Electrical background is preferred
+ F& B5 C* M! u0 n2 x3 G5.More than 3 years Design experience on transformers
3 |+ o( p+ a4 M; Q' L! \6.Basic English written and speaking skills* J& }+ G5 i, h

; ~& j" J8 r6 k9 ]- e' m# I: bJob Scope:- j0 @/ p- @. N2 S
1.Receive training to be LVDT design engineer, gain the capabilities to be able to design new LVDT’s per the marketing requirements. U  m  D' z) V# s, ]) a
2.Provide solutions and suggestions to the potential customers per the applications, business trip to the field may be required.; _; ]0 H0 h5 \7 N0 j; w" j
3.Work with the electronics and mechanical engineer to improve the old LVDT designs$ i0 [: U# s4 ^& a. g& Q, B/ E2 v
4.Support the LVDT manufacturing to resolve engineering related problems+ g6 ]$ c& y+ f% T  R/ k/ z& I
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WB principal process engineer

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! I, ?% R2 X2 w' o' M# LRequirements:
1 x+ B9 }, L  H7 F- {*Bachelor degree in related subject
/ q( Q$ n: h: s# P) \*Proven results in applying six sigma tools to major electronic processes including Wire Bonding, Die Attach, Adesives&Sealants, Curing.
8 s" `3 g$ W3 X/ K*Minimum 5 years in manufacturing engineering.
& _, Z9 [4 f6 a' ?9 ]) w. K*Good communication and some leadership skills prefered.7 M$ {- [. Z! N# ?( d/ A) p" M0 J
*Good command of English writing and speaking
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6 P+ |: f4 c/ h8 wJob Scope:9 a2 F& o. z# h. I
* Process engineering in electronics specialties.
# B$ n* S# [" h* First and foremost wire bonding design and process for Al wedge bonding & Au bonding
# C) N$ A$ @0 E* Oversee company wide processes in fields of expertise.5 G1 }$ R3 f- s7 w5 {6 g- X9 @) q
* Report to foreign Manufacturing Engineering Porject Manager2 E+ I% ]6 t; s5 Q' o- i7 I# L
( ]) @) X* |+ m2 h
[b]
/ K# ~4 B: P3 G) ^- b- V5 t空口标准研究员

' s! {. R' Y2 h, y; E1 Y一、主要职责:$ ?6 I$ k' t( w
●申请专利,撰写提案,牵头推进提案被相应的标准组织采纳;# }5 B# O* Q" N
●负责跟踪、分析和研究相关无线通讯领域标准化发展趋势和动态;2 j; G( p0 s& p7 d
●通过标准会议,了解运营商的需求,分析各方面的主张,推动有效的产品设计。2 K: @% d# Z  d3 k" k
5 S+ a+ S7 ~7 F, @5 O- |8 L
二、任职资格:' E% h9 q6 w* A4 P
●本科以上,具有扎实的通信,电子或者数学基础;6 a0 U$ Y8 \$ U6 M  y2 i  G1 c8 ~  i
●精通数字信号处理、信号与系统的经典内容、熟悉OFDM物理层者优先;
, c: K. s+ r" G8 d  u0 E●电子/通讯/计算机/自动控制/电子物理/应用数学等相关专业毕业;3 q& E& }9 h0 T5 H3 e
●具有较强的学习能力、强烈的创新精神、良好的沟通,理解能力,以及团队合作精神;
6 v) ?3 B& u1 d: c$ a●流利的英语读、写和听说能力;
! l. E5 p( v. \5 o( m8 g●至少3年以上无线通信空中接口研究,系统设计方面的经验;8 [$ }2 q: t; p0 ]& |
●至少1年以上标准预研工作经验;
. F( ]3 h4 O! n( B●有海外类似通信岗位工作经验者优先;  X6 t) Q1 l, X/ U8 z2 A, k- C/ a
●有国际通信类标准会议1年以上持续参会,并有国际提案者优先。
' n% x' B! B4 ?3 I" u: ^
* W! Y2 {4 ~  |) C
" z0 R+ s& q9 ^6 g5 K0 O网络标准研究员
7 z" _' z' F. o& c5 x2 e一、主要职责:. e$ L2 y* a* u0 S  ]
●申请专利,撰写提案,牵头推进提案被相应的标准组织采纳;* r. P5 m, [0 \/ T$ K, M5 B
●负责跟踪、分析和研究相关无线通讯领域标准化发展趋势和动态;
, N0 e, [, i. a8 u6 W' Q. B7 }0 B●通过标准会议,了解运营商的需求,分析各方面的主张,推动有效的产品设计。2 |- b- }4 S7 t6 R1 g- j8 E* P
" A6 j7 A2 L7 E
二、任职资格:
8 b5 c. `3 N, h0 f' h●本科以上,具有扎实的通信,电子或者数学基础;" G; z! u! F/ Z/ [0 s1 M
●熟悉IP相关协议;
7 Z4 q5 r% @- }# c' G( D) c●熟悉3GPP或者3GPP2户或者IEEE等标准组织的工作方式;* A" z. V4 N2 w! o$ n% Z2 C* F
●电子/通信/计算机/自动控制/电子物理/应用数学等相关专业毕业;) V" C% X% D8 M, G. Y# G$ T
●需要具有较强的学习能力、强烈的创新精神,良好的沟通、理解能力以及团队合作精神;
0 F: a7 s* u" s9 o●流利的英语读、写和听说能力;+ ~8 `% y7 E) B* x
●至少3年以上通信系统网络研究,系统设计方面的经验;3 u# I/ D; w9 T4 U) j/ k! W
●至少1年以上相关标准预研工作经验;
' J8 M: W4 p& l2 B●有海外相关岗位工作经历者优先;, E" h! W3 \$ u& D% k
●有国际通信类标准会议1年以上持续参会,并有国际提案者优先。
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& S  ^  P- I. v" t; Q& a: b高级知识产权运营经理
' @! T( q1 r, e1 w6 l直接上司:知识产权总监+ b# ?! {& `  x. z8 C! C: N
岗位主要职责(一般情况下具体的任务和职责):# q3 P3 u3 T- F& r2 Y
设计IPR经营策略并推进实施;
/ t/ _5 C8 f% ~9 h负责或参与IPR许可谈判项目;
0 h( t/ c9 \7 F" fIPR许可的实施、审计监控;
/ }4 V+ P7 w9 G/ D2 |7 S4 s. MIPR许可合同起草和审核;
* N$ w. k2 ?& {" `2 J2 j负责IPR诉讼和纠纷的处理;* A; B2 ~4 x  W9 s4 v& g
IPR许可相关的课题及策略研究。5 V- @: c% s# L* M
工作地点: 深圳+ c" E& c( Z- J# e! `/ v
任职的主要条件: 8 E3 t- F& S. u  W) x' [  S
重点本科以上学历,通讯、电子或计算机相关专业;
: P0 U; a8 M! r/ c* \: X具有良好的法律基础,具有法律硕士学位或者知识产权双学士优先;) {# R+ p( M0 T. c
8年以上知识产权相关工作经验,具有3年以上知识产权许可谈判经验者优先,对知识产权尤其是专利有着深刻的理解;) @' O4 i2 {" {, e
英语口语好、读写熟练;' D7 h8 L9 i1 q& t1 J
具备良好的表达能力、创新性和专业思维能力强,具有团队合作精神,能够承受较大压力。. v: v+ F5 V# o8 B" Q# r
优先考虑的条件:
9 N# d7 I8 R8 @' M' O7 ~; j0 E有欧美、日韩企业IPR许可谈判经验者;8 H/ O3 @7 f0 \; q+ W: _3 f$ a
有3年以上知识产权许可谈判经验者。& s; z( H, t/ a; g& h3 J9 x, J

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知识产权审计经理
( X7 M1 d# a$ c直接上司: 知识产权总监& }  u& G# U" B6 Y
岗位主要职责(一般情况下具体的任务和职责):
- x1 v9 a0 O7 n3 C5 Q对国内、国际专利申请流程、专利撰写质量、知识产权布局以及答复审查意见的质量进行审计;把握各环节知识产权质量,并监控知识产权质量的持续提升。
- j% c7 A! K% r8 ?0 B工作地点: 深圳
2 I$ Z" u+ W- Y" m/ \任职的主要条件:
' @# W" s0 e. s& Y具备电学背景,专利岗位五年及以上工作经验,有丰富的专利撰写、专利代理或者审查经验,答复过大量的专利审查意见,熟悉专利布局及国际专利申请。. L' e  L$ ^, B; N

+ \3 F0 ^( L; x7 Q* |" V( E$ X) o4 G% X" B1 ~% S5 b
High-speed Optoelectronic Packaging Project Leader 项目组长1 D( Z7 w+ {& h5 O

- L6 B0 Z3 M! P, ~$ _6 cResponsibilities : 8 w' _9 M5 V+ l# f9 _- l2 y: W1 W+ V
Project leader in high-speed optoelectronic packaging group. Group is responsible for fixed-wavelength and tunable TOSA packages and ROSA packages for high-speed datacom and telecom applications. Project lead would be responsible for the successful development and transfer in to production of leading, new OSA product designs. Requires interfacing with marketing, chip development, operations and supply-chain.
! Q* A' F8 W0 v, G1 ]- g5 i$ gQualifications : ) p$ M) k6 @( |8 A# c* P) a
• Masters or Ph.D. in Electrical Engineering, Materials Science or Physics
1 N7 \# H5 z0 W& r• Minimum 5 years of experience in the development of opto-electronic components;
  M- ]' j3 f# O  v& _• Track record of successful product development projects;
. s) o4 D$ ?$ B) p2 p' Z• Experienced in the transfer of products from the development phase and in to production;
* q5 U: a2 `& d! I" `• Excellent communication skills are needed to contribute effectively in cross-functional teams;8 b; T" i3 v8 i' m+ P- q
• Experience with high-speed (10Gbps) package design for lasers and receivers is an advantage;% O% q5 m8 V) ]9 ?% M
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[b]: J) C0 Q+ }1 Q0 }2 H7 n
High-speed Optoelectronic Packaging Mechanical Engineer 机械工程师
7 Y. G+ l: Z5 v$ e1 y- {

4 k/ y- }4 g3 h6 ~; P7 BResponsibilities :
2 f) ?- X4 S9 E) h( Z3 @- i$ c3 rMechanical Engineer in high-speed optoelectronic packaging group. Group is responsible for fixed-wavelength and tunable TOSA packages and ROSA packages for high-speed datacom and telecom applications. Mechanical Engineer would be responsible for the successful design development and transfer in to production of leading, new OSA product designs. Requires interfacing with development teams in the US and local operations and supply-chain teams.
( Q7 Q* Z, ~2 o& T+ c- J  ^Qualifications : 2 D( ?1 W$ V! D# ]# _1 X# {6 A2 m
• Masters or Ph.D. in Mechanical Engineering* Y, m: C! E7 F( F, Q. }+ O3 ^2 t: c
• Minimum 5 years of experience in the development of opto-electronic components;9 ^7 I# E% A7 }% e& i3 Q
• Track record of successful product development projects;# r+ w8 X' N5 r) {3 b4 ^
• Knowledgeable of the processes and components used in opto-electronic packages;' ~( u( U# z& A0 }2 [7 f+ E
• Excellent communication skills are needed to contribute effectively in cross-functional teams;
  a- ^/ h. P- e9 Y& B6 K% i• Experience with high-speed (10Gbps) package design for lasers and receivers is an advantage;
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3 l" g) D/ M* x, e4 |
; @# d/ w8 O2 T- Y- a; [# A# VHigh-speed Optoelectronic Packaging RF Engineer 射频工程师
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Responsibilities : 0 i) V# ]0 N) T+ N! J+ T
High-speed Design Engineer in high-speed optoelectronic packaging group. Group is responsible for fixed-wavelength and tunable TOSA packages and ROSA packages for high-speed datacom and telecom applications. The High-speed Design Engineer would be responsible for the successful design, development and transfer in to production of leading, new OSA product designs. Specific responsibilities would be for the characterization of new high-speed products during the development phase and working with the Operations team to develop production test solutions. Requires interfacing with development teams in the US and the local operations team.1 r& [% o. b. H2 S( B
Qualifications :
& F4 q: I- c/ I$ C0 g1 ?9 c2 S• Masters or Ph.D. in Electronic Engineering or Physics.
: O3 c5 R5 V0 C$ ~$ G• Minimum 5 years of experience in the development of opto-electronic components;
- C# l: \/ t6 f' j- E5 h• Track record of successful product development projects;/ F& X5 y% j, T9 {  \
• Experienced with high-speed (10Gbps) package design for lasers and receivers;
) l9 J, s! T, l& i. M" V• Knowledgeable of the processes and components used in opto-electronic packages;3 k$ U1 M. T% n# }; {- D
• Excellent communication skills are needed to contribute effectively in cross-functional teams;
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) B2 `% r: a! {$ ?2 H以上职位上班地址都在深圳:' u9 e% d3 m8 ?! l; E1 K% t
有意者请发个人简历到:ken.wang@manpower.com.cnake.nw@hotmail.com% K% \/ Q$ E; Q" Q" F+ a  v
电话:13923780106    MSN: ake.nw@hotmail.com
沙发
发表于 2007-10-15 15:52 | 只看该作者
都是比较高级的职位呀   [s:87]
板凳
发表于 2007-10-15 16:05 | 只看该作者
高级才会有钱嘛
* i7 r4 Q; a# w4 N
# A; V$ t# D8 H# P2 ^/ b21C最贵的是   人才
地板
发表于 2007-10-15 16:23 | 只看该作者
强人才会被猎头盯上嘛~
5#
发表于 2007-10-15 22:08 | 只看该作者
有机械安全的不?
6#
发表于 2007-10-15 22:10 | 只看该作者
本人作过两年的安全认证
7#
 楼主| 发表于 2007-10-17 16:09 | 只看该作者
大家可以把简历发过来看看,,机会大把的有,大家要自信才是呀!
8#
 楼主| 发表于 2007-10-23 15:16 | 只看该作者
没有机械安全的,,,以后会有的,,,可以先把简历发过来,,,,以后一有机会会第一时间向你推荐的,,,。
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