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- I! J/ E9 _- d0 j
Standard:
! \; A; j; ]' \# `IEC60950, 3rd Ed.( z/ b0 x( A3 q; T6 S( r- f% T2 B
Sub clause:
- N9 g3 A% B; ]( F1 H2.9.1 and 2.9.25 P" M; d2 ^6 K( a3 i
Sheet n. 3732 {" V1 J/ _6 Y, I
Page 1 (1)
4 t8 d4 [5 h. V: F7 D$ X1 X* |Subject:5 f% }& g3 p# O7 ^# I
Humidity conditioning
$ h t6 B5 k% ?: HKey words:
" ]5 y9 K$ K/ u-Insulation+ o" T: |- d% T1 y& C
-Humidity& y* e- \7 a9 X( U) ~
Decision confirmed
4 x+ C) Q% O, K) \5 E6 i; kat CTL 38th meeting
! O' r5 e7 ]% ^, w- d- NQuestion:
4 J/ Y8 H# |" b: }( ?, qSub-clause 2.9.1 specifies that " the component or subassembly" be subjected to the8 f- b' |9 H2 t7 S5 _7 A
humidity treatment of 2.9.2. Sub-clause 2.9.2 specifies that " during the conditioning the4 [9 @: g! L+ Y
component or subassembly is not energized".
1 H; }. o, |- S: t3 lCan these requirements be interpreted in the way that only components and subassemblies+ S+ \; o$ g* S1 }
need to be subjected to the conditioning and not the equipment where these components0 W7 ~; I4 h2 P! b
and/or subassemblies are mounted?7 G! }9 z0 e1 B; k* O8 w# w
Decision:# G, v$ \" x6 I1 X/ d
Yes.
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; H1 I; h( l9 k! p3 \* S5 V& r1 }) X3 e5 i
% ], u2 a/ u2 r: b) ~, [0 q
+ O5 C: j) e- }' d8 n" B; c |
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发表于 2012-11-6 17:52
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