DSH 380 Affect of solder resist on Comparative Tracking Index (CTI) of Printed

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DSH 380 * ?& ^3 r6 m% P2 [! C

Affect of solder resist on Comparative Tracking Index (CTI) of Printed Wiring Boards

2.9.3, Table 6, Condition 3 . D& q- |) C# R6 Q" l3 m& ?

60950(ed.2) & 60950(ed.3) . z3 A$ b% ^/ T' W

0 g- Z: b& u7 |6 s4 [. lStandard:
IEC 60950, 2nd and 3rd Ed.
' p  V- W  N( Z! W" R0 d0 L4 pSub clause:
# X: N8 J9 a, N3 ~$ k1 Q) C) I2.9.3, Table 6, condition 3
Sheet n. 380
6 R4 z& _" D9 R( @2 c- f' d8 U# c3 XPage 1 (1)
Subject:
  X( e3 a3 w. Q9 _9 ~! ]& [$ |Affect of solder resist on
Comparative Tracking Index (CTI)
; B; N; c, j9 y" s, ]# fof Printed Wiring Boards
. l. t. ^8 Q. n# sKey words:
! o4 {6 j* R* A+ c-comparative tracking index
-CTI
-printed wiring boards
: N& Y% h. @' ?) s2 G-PWB
  r: I/ j6 A0 Z-solder resist
Decision confirmed
at CTL 38th meeting
2 s. B+ s6 ~; u0 x7 xQuestion:
The measured Comparative Tracking Index (CTI) for a printed wiring board with solder
resist present can be different than that for the printed wiring board without the solder resist.
The creepage distances required in the standard depends upon the CTI for the printed wiring
" B6 L% p. u1 P- d' y4 T3 Jboard.
Should the presence of solder resist on a printed wiring board be considered in determining
the CTI when determining the creepage distances requirements to be applied?
( p3 }+ Z' T4 p+ N+ eNote – Clause 2.9.5 does not apply to this question because the assembled printed wiring
- _5 F4 J7 K0 x2 D& s) ~! h2 }7 vboard is not covered with a conformal coating.
Decision:
* O8 W5 D* v* R, Y- Q9 @6 X& p; hYes.
) l6 ^8 |; G' p0 _
; p. f3 r% V4 a! J8 M