|
| DSH 373/ w, O- `) U ~3 X8 f. `& T
& j( _( j) ~) i
| Humidity conditioning+ a5 n3 t, B- a; r6 [7 o+ d, W
| 2.9.1 and 2.9.2' Z, m. E5 T, @9 J
| 60950(ed.3)
0 `+ L L" m: I6 B" F* o( F" o | " e+ @" ~- W; C/ g) T* u
Standard:
# ?, k4 f' @" b* @' K2 {' GIEC60950, 3rd Ed.: O& O6 s9 v/ f8 j# f3 q. E j
Sub clause:2 j7 v: o5 Z o
2.9.1 and 2.9.2
) ~/ h f) a4 V6 C6 XSheet n. 373
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* W* u: ] r, G& `. K$ RSubject:
' k3 ?) U3 I+ Z& k/ ]Humidity conditioning
9 |9 O2 t7 ~( @Key words:
0 S! z' y2 x( B% w-Insulation
5 _/ K# A7 p0 V+ a: x-Humidity% }6 j6 l4 [# B* U5 b; r1 S
Decision confirmed
" F6 b) n5 v) D0 Y8 Y0 U+ t( D) dat CTL 38th meeting
: f) Y5 J1 _" cQuestion:
1 f& F, Y# E! L# x; a" cSub-clause 2.9.1 specifies that " the component or subassembly" be subjected to the; W/ Z# G$ `5 z; X/ y& a/ R- I
humidity treatment of 2.9.2. Sub-clause 2.9.2 specifies that " during the conditioning the6 y' e" Y, U2 Y8 s' T* a
component or subassembly is not energized".+ {$ K: u2 u1 v7 K
Can these requirements be interpreted in the way that only components and subassemblies
; V. k& B: C3 D' vneed to be subjected to the conditioning and not the equipment where these components2 {& q4 i5 Q: T7 c0 q1 N0 V
and/or subassemblies are mounted?# B6 y* k; Y4 r
Decision:
2 ?0 ^0 n/ ^7 W" w4 _, `Yes.6 o* b8 r( g# m& }" O9 w/ V
4 H+ r5 k4 Z" X8 b/ a/ q
6 o6 b u1 M8 X+ ~& l: O/ M- s! C7 @ H% u- ~/ C' W1 i
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