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|  DSH 3736 a: H0 R! U a& Z( `3 \
( U. C) K3 f$ }4 v6 _* Y# | | Humidity conditioning
3 x* l7 L" \7 P2 ?! g | 2.9.1 and 2.9.2" B' V. {! u: \
| 60950(ed.3)
! n% G/ W8 p1 _ |
6 h0 g4 e2 m# Q6 a8 E- QStandard:
" E( p1 k0 l$ U8 @) i% A& z3 @; v7 {: RIEC60950, 3rd Ed.6 v* Q, C5 }6 U2 ~5 O5 k: D
Sub clause:; V$ f5 M, N$ Y) c D5 i7 L, D) ~
2.9.1 and 2.9.2/ L# x6 h; l" Y" O9 V
Sheet n. 3738 C8 E, X2 T" q6 }( r* V
Page 1 (1)8 V% z! z) `1 Y v+ R) b
Subject:
9 f1 f. E2 B1 V, y8 tHumidity conditioning! e. J; W1 L! F9 g9 t2 [* }
Key words:
1 l; i8 Z2 ?5 l' r- S' N/ {2 X-Insulation
- c/ Z' ?* q0 n# [4 O% I& }-Humidity) z9 g, O, p9 \) c; J7 v6 i
Decision confirmed
5 K5 T+ w% w! P" A+ k7 b- v( Hat CTL 38th meeting1 M- ?2 a* H1 K% `/ @2 w! [
Question:
* [' _7 H+ g4 l- ^4 vSub-clause 2.9.1 specifies that " the component or subassembly" be subjected to the7 V/ n1 |6 i2 l! Z
humidity treatment of 2.9.2. Sub-clause 2.9.2 specifies that " during the conditioning the8 H( Y4 @: Q, c9 m7 O# g* B
component or subassembly is not energized".
8 W# P T; G H( Q ACan these requirements be interpreted in the way that only components and subassemblies8 `0 Z" e- |/ e
need to be subjected to the conditioning and not the equipment where these components
( y g$ Y% [1 U' @and/or subassemblies are mounted?/ J H( c0 Y8 \- ~6 |8 k1 l$ A
Decision:
( n$ w6 R- L: h, f+ JYes. [& F% N2 \. Z5 E) F& N+ p- O
\ l0 h8 C( h. |3 D
s8 `/ @( F/ V8 J. ~, A
' h0 L9 V v2 b& g
! v* M% t. ~5 V2 m |
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发表于 2012-11-6 17:52
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