jsspace 发表于 2012-3-30 08:23

这是我上次做的一个LED球泡灯的UL目击测试温点。
Lamp base center, inside(represent for lamp base enclosure temperature)
Lamp base holder, near to transformer
T1
Insulation sheet, at bottom side of heat sink, near the bottom of LED package
Top Cover, near the heat sink
Glue of the between the Top Cover and Front Ring Cover
Heat Sink, outside, contact surface
Potting Compound
LED driver :
Bobbin of Transformer (T1)
Coil of Transformer (T1)
Multi-layer insulated wire
Coil of Inductor (L1)
Body of Inductor (L1), near Q1
Fuse F1
C1 body
C2 body, near Q1
CY1 body
Varistor (MOV)
Output Lead of LED Driver, near the LED package
PWB, top layer, near T1
PWB, bottom layer, near T1
PWB, top layer, near Q1
LED board:
PWB, near LED package

songbolove 发表于 2012-3-30 08:52

mountaindog 发表于 2012-3-29 22:09 static/image/common/back.gif
IEC62560要求只要测灯头温度
但是灯泡里面还是要参照IEC60598布点测试

灯头温升是必须要测试的，但是，知道耐热球压试验的温度确认是哪里来的？ 就是从温升测试来的。
这与UL相类似。

songbolove 发表于 2012-3-30 08:54

jsspace 发表于 2012-3-30 08:21 static/image/common/back.gif
金属外壳吗？ 如果是金属外壳，没有要求。 如果是塑胶外壳，请查看相应的RTI



像CE就没有什么RTI了，此方向是UL
CE主要还是测试温升，确定球压试验温度， 以及通过灼热丝试验来考核塑料件。

zgr200277 发表于 2012-3-30 09:03

很好，学习学习

songbolove 发表于 2012-3-30 09:13

songbolove 发表于 2012-3-30 08:54 static/image/common/back.gif
像CE就没有什么RTI了，此方向是UL
CE主要还是测试温升，确定球压试验温度， 以及通过灼热丝试验来考 ...

互相学习

songbolove 发表于 2012-3-30 09:14

jsspace 发表于 2012-3-30 08:23 static/image/common/back.gif
这是我上次做的一个LED球泡灯的UL目击测试温点。
Lamp base center, inside(represent for lamp base encl ...

这个，是不是少了wire 的点的测试？

songbolove 发表于 2012-3-30 09:15

jsspace 发表于 2012-3-30 08:23 static/image/common/back.gif
这是我上次做的一个LED球泡灯的UL目击测试温点。
Lamp base center, inside(represent for lamp base encl ...

写法很像苏州UL

jsspace 发表于 2012-3-30 09:18

songbolove 发表于 2012-3-30 09:15 static/image/common/back.gif
写法很像苏州UL

广州UL的

jsspace 发表于 2012-3-30 09:19

songbolove 发表于 2012-3-30 09:14 static/image/common/back.gif
这个，是不是少了wire 的点的测试？

有啊
Output Lead of LED Driver, near the LED package

songbolove 发表于 2012-3-30 09:23

以下我觉得描述比较正
Enclosure, inner surface, near T2
Enclosure, inner surface, near Q1
Enclosure, inner surface, near BR1
Diffuser Cover, nearest to heatsink
Diffuser, inside, near LED
Input lead, near L1
Output lead, near to LED / T2
Connector, near LED
LED board, near center LED
PWB foil trace side
T1 winding
L1 winding
L3 winding
IC1
Capacitor CX2
Capacitor CY1
Capacitor CY2
Insulation, contact heatsink
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