半导体部件的本体如何做绝缘的问题
对于普通半导体的本体, 一般都不当作绝缘, 大家有没有见过本题可以做绝缘的半导体? 传说中整流桥可以，但只是传说，没见过。 半导体本体做绝缘？怎么做，只有外面通过灌胶等封装绝缘的。你说的这种形式我还真没见过。 楼主说的不知道是什么情况，谁来解释下。。 根据OSM决议，满足以下要求可以当做基本绝缘。2. 10. 5 The plastic enclosure of a semiconductor can be considered as basic insulation. These components including alternatives must be listed in the list of critical components and there must be a remark in the service documentation 整流桥有做UL认证的，本体打2500Vac都是没有问题的。 alex, 请分享一下完整的OSM. 这个OSM怎么跟玩过家家差不多。 peter, 决议原文如下：
OSM/EE DECISION SHEET
Standard:
EN 60950:2000
EN 60950-1 :2001 Sub clause:
2.10.5 Sheet no. :
95/17
Page: 1 of 1
Subject:
Insulation of plastic enclosure of semiconductor component Key words:
Semiconductor insulation Meeting:
OSM/EE - 1995
Item 9.14
Question:
Type ofinsulation of plastic enclosure of semiconductor component
Decision:
The plastic enclosure of a semiconductor can be considered as basic insulation. These components including alternatives must be listed in the list of critical components and there must be a remark in the service documentation.
Explanatory Notes: - ok, 谢谢
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