多层板的内层原副边距离可以比外层距离小？
本帖最后由 火水晶 于 2013-9-27 14:32 编辑如题，模块电源，10/12层板，外层的原副边基本绝缘要求距离为1.4mm，内层的原副边基本绝缘要求距离要求0.5。
请高手指教，60950/4943中哪部分有对内层距离可以减小的描述啊？
参考2.10.6，好好读读吧～ wpcily 发表于 2013-9-30 09:09 static/image/common/back.gif
参考2.10.6，好好读读吧～
我2.10.6这章都快翻烂了，还是没有看出眉目，请指导！ 火水晶 发表于 2013-9-30 14:05 static/image/common/back.gif
我2.10.6这章都快翻烂了，还是没有看出眉目，请指导！
对于多层板，若是内层同一表面，要求参照2.10.5.5；若是不同表面，基本绝缘的话没有要求，只有附加或加强，要求绝缘穿透距离。 多層板的內部距離你是怎麼弄出來的，求解 我在旧版的标准中有看到不同的描述：
2.10.5.3 Printed boards
For the inner layers of multi-layer boards, the distance between two adjacent tracks on the same
layer of a printed board is treated as distance through insulation (see 2.10.5.1).
内层距离当成是绝缘穿透距离。
但新标准已经对这部分做了修改，改为
2.10.6.3 Insulation between conductors on the same inner surface of a printed board
On an inner surface of a multi-layer printed board (see Figure F.16), the path between any two
conductors shall comply with the requirements for a cemented joint in 2.10.5.5
2.10.5.5 Cemented joints
Where the path between conductive parts is filled with insulating compound, and the insulating
compound forms a cemented joint between two non-conductive parts (see Figure F.18) or
between a non-conductive part and itself (see Figures F.16 and F.17), one of the following, a),
b) or c) applies.
a) The distance along the path between the two conductive parts shall not be less
than the minimum CLEARANCES and CREEPAGE DISTANCES for Pollution Degree 2. The
requirements for distance through insulation of 2.10.5.2 do not apply along the joint.b) The distance along the path between the two conductive parts shall not be less
than the minimum CLEARANCES and CREEPAGE DISTANCES for Pollution Degree 1.
Additionally, one sample shall pass the test of 2.10.10. The requirements for distance
through insulation of 2.10.5.2 do not apply along the joint.
c) The requirements for distance through insulation of 2.10.5.2 apply between the
conductive parts along the joint. Additionally, three samples shall pass the test of
我们公司一般应用的是2.10.5.5中的a），
所以在新的标准里，内层的距离和外层的绝缘距离是相同的。
请高手指教，我的理解是否正确。 xidua-10 发表于 2013-10-4 16:43 static/image/common/back.gif
多層板的內部距離你是怎麼弄出來的，求解
见GB4943-2011的2.10.6.3 火水晶 发表于 2013-10-12 10:14 static/image/common/back.gif
我在旧版的标准中有看到不同的描述：
2.10.5.3 Printed boards
For the inner layers of multi-layer boa ...
a,b,c均可；用a当然没有问题，只是内层距离太大，对layout来说有难度。我们之前都是对所有PCB供应商的PCB板做热循环测试2.10.10，内层都用c来做；当然如果PCB的温度小于90度，那就连热循环都不要求了。
页:
[1]
