DSH 380 Affect of solder resist on Comparative Tracking Index (CTI) of Printed
http://decisions.iecee.org/icons/ecblank.gif DSH 380
Affect of solder resist on Comparative Tracking Index (CTI) of Printed Wiring Boards
2.9.3, Table 6, Condition 3
60950(ed.2) & 60950(ed.3)
Standard:
IEC 60950, 2nd and 3rd Ed.
Sub clause:
2.9.3, Table 6, condition 3
Sheet n. 380
Page 1 (1)
Subject:
Affect of solder resist on
Comparative Tracking Index (CTI)
of Printed Wiring Boards
Key words:
-comparative tracking index
-CTI
-printed wiring boards
-PWB
-solder resist
Decision confirmed
at CTL 38th meeting
Question:
The measured Comparative Tracking Index (CTI) for a printed wiring board with solder
resist present can be different than that for the printed wiring board without the solder resist.
The creepage distances required in the standard depends upon the CTI for the printed wiring
board.
Should the presence of solder resist on a printed wiring board be considered in determining
the CTI when determining the creepage distances requirements to be applied?
Note – Clause 2.9.5 does not apply to this question because the assembled printed wiring
board is not covered with a conformal coating.
Decision:
Yes.
页:
[1]
